Computer-on-Module Solutions
Made for customisation
Boost your time-to-market
Typically, clients choose between off-the-shelf products and complete customized solutions. Data Respons Solutions’ trademark is “Custom-Off-The-Shelf-to-Market”. This means that we use existing platforms and components from leading technology providers and adapt them perfectly for our customers’ applications.
High level services – your competitive advantage
Hardware adaptations, development
Baseboard development
Standard products from leading manufacturers
Custom image creation for operating systems (Linux, WIN)
Software development / support
Certification
Part of our overall concept is to support our customers even after the successful completion of the project. Besides customisation, we offer a whole range of additional services to ensure the reliability and longevity of your embedded & IoT solution.
Computer-on-Module-Standards
COM-HPC – High performance Computer on Module formfactor
COM-HPC Server Module
Edge computing is a fast-growing segment requiring ever higher performance. The system memory requirements of current and future high-end embedded multi core processors have grown very steeply. Existing popular form factors such as COM Express cannot provide cost effective solutions when memory requirements approach 128 GB or 256 GB. This is where COM-HPC comes into play. Five sizes are defined with the largest intended for use as a server module that allows for up to 8 DIMM sockets onboard.
COM Express
COM Express Type 10 Modules
The COM Express Type 10 module is intended for low power platforms (TDP 12W and below), such as handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications. The COM Express Type 10 Mini (84 x 55 mm, credit card size) is capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications.
COM Express Type 7 Module
One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
COM Express Type 6 Modules
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
Qseven
Qseven – the small & highly integrated COMs
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
SMARC
SMARC for Embedded Vision
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
Our Industry Focuses
